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Automation Systems Funding

Pillsbury Winthrop Shaw Pittman LLP

Biden Administration Announces Research and Development Program to Accelerate Semiconductor Advanced Packaging

Under the Department of Commerce, the program will provide funding for research and development projects to support U.S. semiconductor advanced packaging and strengthen the manufacturing and packaging workforce. The Biden...more

American Conference Institute (ACI)

[Event] The National Forum on IP Funding and Tech Strategies for Novel Therapeutic Modalities and Gene Therapies - March 21st -...

Hosted by American Conference Institute (ACI), the National Forum on IP, Funding and Tech Strategies for Novel Therapeutic Modalities and Gene Therapies will highlight leveraging technology, safeguarding IP, and securing...more

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